About of Filtronic Die Attach
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Main Features
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![[Eng Sub] Die Attach Process: Paste type adhesive, Film type adhesive](https://i.ytimg.com/vi/wLisuXB58rk/mqdefault.jpg)
[Eng Sub] Die Attach Process: Paste type adhesive, Film type adhesive
DIE ATTACH PROCESS
Product production process--Die bonding
Discover: die-to-wafer hybrid bonding | CEA-Leti
Filtronic - Customised manufacturing solutions
Manual bonding - ideal for NPI and rapid prototyping
![[Eng Sub] Flipchip die attach process: Bump, MR(Mass Reflow), TCNCP, LAB(Laser Assist Bond), NCP](https://i.ytimg.com/vi/Yr_1vcYdbvI/mqdefault.jpg)
[Eng Sub] Flipchip die attach process: Bump, MR(Mass Reflow), TCNCP, LAB(Laser Assist Bond), NCP
Lead-free die attachment
High precision X/Y set up to +/- 15 microns, 3 sigma
Die Attach Processes
Lead Free Die Attach Systems - Sintering
Deep Dive
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Last Updated: August 24, 2026
Final Thoughts
![[Eng Sub] Die Attach Film (DAF) - FOW, FOD, NAND News](https://i.ytimg.com/vi/NBm8fPThYwU/mqdefault.jpg)
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